Consistency is the key to Almit's advanced solder paste formulation. Almit uses only the purest raw materials with a perfect particle size to ensure its solder paste never varies. That means there's always the same amount of paste in your stencil aperture to give ideal printability and eliminate adjustments on your screen printer. The result is higher yields, less rework and a reduction in the quantity of paste used. Stringent processing controls also give Almit solder paste an exceptionally extended life. In fact, Almit paste permits a generous 24-hour process cycle with up to one hour on the stencil between print strokes, eight hours on the board before placement, and a 16-hour window before reflow. Add a six-month shelf life and excellent wetting properties and you can see why Almit solder paste is specified by so many of Europe's top manufacturers.
Specifications
Code |
Composition |
Characteristics |
HM-1 RMA Sn63 |
Sn63/Pb37 |
• Excellent printability, giving a stable process with the
absence of solder balls or bridging
• No clean
• Quality improvement and usage saving with prolonged
print life and tackiness |
HM-1 RMA Sn62 |
Sn62/Pb36/Ag2 |
• Excellent printability, giving a stable process with the
absence of solder balls or bridging
• No clean
• Quality improvement and usage saving with prolonged
print life and tackiness
• For use on PCBs and components where silver is present |
HM-1 RMA SJ-7 |
Sn62/Pb34.5/ Ag3/Sb0.5 |
• Double tensile strength as compared with Sn60/Pb40
solder
• No migration or mechanical breakdown at higher
temperature range
• No crack occurrence from heat cycle test
• For use on PCBs and components where silver is present |
HM-1 RMA SJ-S |
Sn/Pb/Bi |
• Manufactured to improve reflow of BGAs and microBGAs,
improving solderability at reduced temperatures without
compromising joint strength |
*
All products are available in a variety of particle sizes
and flux types dependant on the application |
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