Solder Paste | Solder Wire | Flux | Consumables | Optical | Dry Storage
 Solder Paste | Solder Wire | Flux | Consumables | Optical | Dry Storage

 

Lead Free    Almit's lead-free solder paste and solder wire range
 embraces today's environmentally responsible manufacturing
 strategies while still including innovative formulations, such
 as Bismuth, for lower melting points with no mechanical
 disadvantage.

      Companies wishing to change to a lead-free solder
 should, in the short term, seriously consider Almit's LFM-48
 Sn/Ag/Cu range of alloys. Alternatively, look at the addition
 of either Bismuth or Antimony, the choice being dependant
 on temperature or strength requirements.

      Overall, the Almit range of lead-free and low-lead alloys
 have superior mechanical properties than that of standard
 Sn/Pb.

 For more information
 View our Lead-Free Presentations by clicking on the links
 below. (Acrobat Reader required).
Code
Composition
Characteristics
LFM-8
Sn/Ag/Cu/Bi
•   Melting point 219°c

•   Suitable for applications where assembly is reflow temperature sensitive
LFM-22
Sn/Cu
•   Melting point 227°c

•   Suitable for surface mount assembly applications where both high
     speed and high reliability are desirable
LFM-48
Sn/Ag/Cu
•   Melting range  217 - 220°c
* All products are available in a variety of particle sizes and flux types dependant on the application

 

Lead Free Wire Specifications

Code
Composition
Characteristics
KR-19 SH RMA LFM-8
Sn/Ag/Cu/Bi
•   Melting point 219°c
KR-19 SH RMA LFM-22
Sn/Cu
•   Melting point 227°c

•   Ideal for low residue hand soldering

•   No clean
KR-19 SH RMA LFM-48
Sn/Ag/Cu
•   Melting range 217 - 220°c

*All above wires available in 0.5mm to 1.6mm diameters

* Almit specialises in cored wire for robotic soldering applications